Root cause failure analysis

Failure analysis is a comprehensive, forensic investigation into the reasons why a product or component has failed. Forensic engineers use a variety of failure analysis techniques and testing methods to identify and evaluate specific root causes behind a failure.  

The root cause analysis procedure involves collecting and analysing data, developing appropriate corrective and/or preventive action, presenting the data clearly and generating a practical recommendation. 

TÜV SÜD operates failure analysis centres in Munich, Singapore and other major production centres around the world to support your failure analysis needs. 

Product or equipment failures can be more than just an inconvenience. They can pose significant risks to the public and the environment. Failure analysis detects the root cause of the failure mechanism and recommends preventive measures to avoid repeat occurrences. Regardless of whether you are a manufacturer or an operator, failures that contribute to downtime can affect your business operations and profitability. Once a cause is identified, businesses can take steps to modify or redesign the product to prevent future failures and safeguard brand reputation. Certain types of analysis are to be done during product prototyping to identify potential areas of failure and address deficiencies before a product reaches the market. 

Failure analysis ensures the following benefits to manufacturers: 

• Avoid disappointment for end customers and the risk of damaging your brand reputation. 
• Improve the quality and safety of products and reduce the risk of future failures in similar devices. 
• Assure the safety of personnel, customers, and the environment. 

TÜV SÜD’s failure analysis centres in worldwide locations provide manufacturers and operators with root cause failure analysis, material and product evaluation services, and reliability testing. 

We are equipped to test a wide range of equipment, including metallics, plastics, electrical and electronic equipment, compounds, petrochemicals, energy tools, rail, aerospace, marine, construction equipment, and medical equipment. 

Our state-of-the-art testing equipment, combined with our experienced engineers and analysts, can meet the most demanding testing requirements within your schedule and budget.  

TÜV SÜD’s Failure Analysis Centres offer a complete range of testing and inspection services for electrical and electronic products and components: 

• Coating/thin film evaluation – Including assessments of coating chemistry, thickness, orientation and quality, as well as adhesion testing. 
• PCB evaluation – Such as plating layer evaluations for thickness and homogeneity, layer delamination assessments and solder heat resistance. 
• Product evaluation – Including x-ray radiography for internal structure or defects, electrical characterisation by curve testing, dye and pry tests for ball grid array (BGA) joints, and solderability testing. 
• Reliability assessment – Including examination following thermal cycling and thermal shock testing, humidity testing and salt spray testing. 
• Surface analysis – Using x-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM) and other techniques. 
• Thermal analysis – Employing differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) among other methods. 
• Chemical analysis – Including inductively coupled plasma mass spectrometry (ICP-MS), Fournier transform infrared spectroscopy (FTIR), and gas chromatography mass spectrometry (GC-MS). 
• Mechanical testing – Such as pull testing, fatigue testing and vibration testing. 
• Electromagnetic compatibility (EMC) testing – For radiated and conducted emissions and immunity. 
• Electrical safety testing – Including isolation barriers and creepage and clearance distances.