Failure Analysis

What is failure analysis?

Failure analysis is a comprehensive, forensic investigation into the reasons why a product or component has failed. Working with failed products or components, forensic engineers use a variety of examination techniques and testing methods to identify and evaluate specific root causes behind a failure.

Product failures can be more than just an inconvenience, they can pose significant risks to the public and the environment. Once a cause has been determined, steps can be taken to modify or redesign the product to prevent future failures. Certain types of failure analysis techniques can be applied during the product prototyping stage to identify potential areas of failure and to address deficiencies before a product is placed on the market.

Why is failure analysis important?

Failure analysis ensures the following benefits to manufacturers:

• Avoid disappointment for end customers and the risk of damaging a brand’s reputation
• Improve the quality and safety of products and reduce the risk of future failures in similar devices

TÜV SÜD is a global leader in failure analysis

TÜV SÜD operates Failure Analysis Centres in Singapore and in other major production centres around the world to provide manufacturers of electrical and electronic products and components with failure analysis testing, material and product evaluation services, and reliability testing.

We are equipped to test a wide range of products and components, including printed circuit boards (PCBs), printed circuit board assemblies (PCBAs), integrated circuits (ICs), capacitors, connectors, batteries, controllers, cables and switches. Our state-of-the-art testing equipment, combined with our experienced engineers and analysts, can meet the most demanding testing requirements within the limits of your schedule and budget.

TÜV SÜD offers a complete range of failure analysis services

TÜV SÜD’s Failure Analysis Centres offer a complete range of testing and inspection services for electrical and electronic products and components:

• Coating/thin film evaluation - including assessments of coating chemistry, thickness, orientation and quality, as well as adhesion testing.
• PCB evaluation - such as plating layer evaluations for thickness and homogeneity, layer delamination assessments and solder heat resistance.
• Product evaluation - including x-ray radiography for internal structure or defects, electrical characterisation by curve testing, dye and pry tests for ball grid array (BGA) joints, and solderability testing.
• Reliability assessment - including examination following thermal cycling and thermal shock testing, humidity testing and salt spray testing.
• Surface analysis - using x-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM) and other techniques.
• Thermal analysis - employing differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) among other methods.
• Chemical analysis - including inductively coupled plasma mass spectrometry (ICP-MS), Fournier transform infrared spectroscopy (FTIR), and gas chromatography mass spectrometry (GC-MS).
• Mechanical testing - such as pull testing, fatigue testing and vibration testing.
• Electromagnetic compatibility (EMC) testing - for radiated and conducted emissions and immunity.
• Electrical safety testing - including isolation barriers and creepage and clearance distances.